From August 26–28, 2025, Inslogic participated in Formnext Asia Shenzhen, held at the Shenzhen World Exhibition & Convention Center. The event gathered leading voices in additive manufacturing and provided an excellent stage to present our latest material advancements.
At Booth D111, Inslogic showcased its full portfolio of filaments, with a special focus on engineering-grade solutions designed for functional and industrial applications. Visitors had the chance to explore our nylon composites, carbon fiber-reinforced filaments, and advanced resin systems, each developed to deliver strength, durability, and consistent performance in demanding environments.
A highlight of the exhibition was our lucky draw activity, where many attendees received 250g samples of Inslogic’s engineering-grade filament—an opportunity to experience firsthand the reliability and quality of our materials.
We sincerely thank everyone who visited our booth, shared insights, and joined the discussion on the future of materials innovation. Your support inspires us to continue pushing boundaries in additive manufacturing.
We look forward to connecting again at the global stage—see you this November at Formnext in Frankfurt, Germany.
Explore the full range of Inslogic materials at:
Website: inslogic3d.com
Store: store.inslogic3d.com
